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| d a t a sh eet product speci?cation supersedes data of 2001 jan 30 2002 aug 02 integrated circuits uba2021 630 v driver ic for cfl and tl lamps
2002 aug 02 2 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 features adjustable preheat and ignition time adjustable preheat current adjustable lamp power lamp temperature stress protection at higher mains voltages capacitive mode protection protection against a too-low drive voltage for the power mosfets. general description the uba2021 is a high-voltage ic intended to drive and control compact fluorescent lamps (cfl) or fluorescent tl-lamps. it contains a driver circuit for an external half-bridge, an oscillator and a control circuit for starting up, preheating, ignition, lamp burning and protection. quick reference data symbol parameter conditions min. typ. max. unit high voltage supply v fs high side supply voltage i fs <15 m a; t < 0.5 s -- 630 v start-up state v vs(start) oscillator start voltage - 11.95 - v v vs(stop) oscillator stop voltage - 10.15 - v i vs(standby) standby current v vs =11v - 200 -m a preheat mode f start start frequency - 108 - khz t ph preheat time c cp = 100 nf - 666 - ms v rs(ctrl) control voltage at pin rs -- 600 - mv frequency sweep to ignition f b bottom frequency - 42.9 - khz t ign ignition time - 625 - ms normal operation f b bottom frequency - 42.9 - khz t no non-overlap time - 1.4 -m s i tot total supply current f b = 43 khz - 1 - ma r g1(on) , r g2(on) high and low side on resistance - 126 -w r g1(off) , r g2(off) high and low side off resistance - 75 -w feed-forward f ff feed-forward frequency i rhv = 0.75 ma - 63.6 - khz i rhv = 1.0 ma - 84.5 - khz i i(rhv) operating range of input current at pin rhv 0 - 1000 m a 2002 aug 02 3 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 ordering information block diagram type number package name description version uba2021t so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 uba2021p dip14 plastic dual in-line package; 14 leads (300 mil) sot27-1 handbook, full pagewidth mgs988 uba2021 supply band gap reference oscillator timing ci 2 g1 control rs monitor non overlap level shifter sb high side driver low side driver 1 fs 14 cf 12 rref 10 vs n.c. 5 rhv 13 4 cp 8 rs 9 bootstrap charging circuit 3 s1 6 g2 7 11 pgnd sgnd fig.1 block diagram. 2002 aug 02 4 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 pinning symbol pin description fs 1 high side ?oating supply voltage g1 2 gate high transistor (t1) s1 3 source high transistor (t1) n.c. 4 high-voltage spacer, not to be connected vs 5 low voltage supply g2 6 gate low transistor (t2) pgnd 7 power ground cp 8 timing/averaging capacitor rs 9 current monitoring input rref 10 reference resistor sgnd 11 signal ground cf 12 oscillator capacitor rhv 13 start-up resistor/feed-forward resistor ci 14 integrating capacitor handbook, halfpage mgs989 uba2021t 1 2 3 4 5 6 7 8 14 13 12 11 10 9 fs g1 s1 n.c. vs g2 pgnd cp rs rref sgnd cf rhv ci fig.2 pin configuration (so14). handbook, halfpage mgs990 uba2021p 1 2 3 4 5 6 7 8 14 13 12 11 10 9 fs g1 s1 n.c. vs g2 pgnd cp rs rref sgnd cf rhv ci fig.3 pin configuration (dip14). 2002 aug 02 5 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 functional description introduction the uba2021 is an integrated circuit for electronically ballasted compact fluorescent lamps and their derivatives operating with mains voltages up to 240 v (rms). it provides all the necessary functions for preheat, ignition and on-state operation of the lamp. in addition to the control function, the ic provides level shift and drive functions for the two discrete power mosfets, t1 and t2 (see fig.7). initial start-up initial start-up is achieved by charging capacitor cs9 with the current applied to pin rhv. at start-up, mosfet t2 conducts and t1 is non-conducting, ensuring c boot becomes charged. this start-up state is reached for a supply voltage v vs(reset) (this is the voltage level at pin vs at which the circuit will be reset to the initial state) and maintained until the low voltage supply (v vs ) reaches a value of v vs(start) . the circuit is reset in the start-up state. oscillation when the low voltage supply (v vs ) has reached the value of v vs(start) the circuit starts oscillating in the preheat state. the internal oscillator is a current-controlled circuit which generates a sawtooth waveform. the frequency of the sawtooth is determined by the capacitor c cf and the current out of pin cf (mainly set by r rref ). the sawtooth frequency is twice the frequency of the signal across the load. the ic brings mosfets t1 and t2 alternately into conduction with a duty factor of approximately 50%. figure 4 represents the timing of the ic. the circuit block 'non-overlap' generates a non-overlap time t no that ensures conduction periods of exclusively t1 or t2. time t no is dependent on the reference current i rref . operation in the preheat mode the circuit starts oscillating at approximately 2.5 f b (108 khz). the frequency gradually decreases until a defined value of current i shunt is reached (see fig.5). the slope of the decrease in frequency is determined by capacitor c ci . the frequency during preheating is approximately 90 khz. this frequency is well above the resonant frequency of the load, which means that the lamp is off; the load consists of l2, c5 and the electrode resistance only. the preheat time is determined by capacitor c cp . the circuit can be locked in the preheat state by connecting pin cp to ground. during preheating, the circuit monitors the load current by measuring the voltage drop over external resistor r shunt at the end of conduction of t2 with decision level v rs(ctrl) . the frequency is decreased as long as v rs >v rs(ctrl) . the frequency is increased for v rs 2002 aug 02 7 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 ic supply initially, the ic is supplied from v in by the current through r rhv . this current charges the supply capacitor cs9 via an internal diode. as soon as v vs exceeds v vs(start) , the circuit starts oscillating. after the preheat phase is finished, pin rhv is connected to an internal resistor r i(rhv) ; prior to this, pin rhv is internally connected to pin vs. the voltage level at pin rhv thus drops from v vs +v diode to i rhv r i(rhv) . the capacitor cs9 at pin vs will now be charged via the snubber capacitor cs7. excess charge is drained by an internal clamp that turns on at voltage v vs(clamp) . minimum gate-source voltage of t1 and t2 the high side driver is supplied via capacitor c boot . capacitor c boot is charged via the bootstrap switch during the on-periods of t2. the ic stops oscillating at a voltage level v vs(stop) . given a maximum charge consumption on the load at pin g1 of 1 nc/v, this safeguards the minimum drive voltages v (g1 - s1) for the high side driver; see table 1. table 1 minimum gate-source voltages the drive voltage at g2 will exceed the drive voltage of the high side driver. frequency and change in frequency at any point in time during oscillation, the circuit will operate between f b and f start . any change in frequency will be gradual, no steps in frequency will occur. changes in frequency caused by a change in voltage at pin ci show a rather-constant df / dt over the entire frequency range. the following rates are realised (at a frequency of 85 khz and with a 100 nf capacitor connected to pin ci): for any increase in frequency: df / dt is between 15 and 37.5 khz/ms during preheat and normal operation: df / dt for a decrease in frequency is between - 6 and - 15 khz/ms during the ignition phase: df / dt for a decrease in frequency is between - 150 and - 375 hz/ms. ground pins pin pgnd is the ground reference of the ic with respect to the application. as an exception, pin sgnd provides a local ground reference for the components connected to pins cp, ci, rref and cf. for this purpose pins pgnd and sgnd are short-circuited internally. external connection of pins pgnd and sgnd is not preferred. the sum of currents flowing out of the pins cp, ci, rref, cf and sgnd must remain zero at any time. charge coupling due to parasitic capacitive coupling to the high voltage circuitry, all pins are burdened with a repetitive charge injection. given the typical application in fig.7, pins rref and cf are sensitive to this charge injection. for the rating q couple a safe functional operation of the ic is guaranteed, independent of the current level. charge coupling at current levels below 50 m a will not interfere with the accuracy of the v rs(cap) and v rs(ctrl) levels. charge coupling at current levels below 20 m a will not interfere with the accuracy of any parameter. frequency voltage <75 khz 8 v (min.) 75 khz to 85 khz 7 v (min.) 3 85 khz 6 v (min.) 2002 aug 02 8 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 limiting values in accordance with the absolute maximum rating system (iec 60134); all voltages referenced to ground. notes 1. human body model: all pins are 3000 v maximum, except pins fs, g1, s1 and vs which are 1500 v maximum and pin g2 which is 1000 v maximum. 2. machine model: all pins are 300 v maximum, except pin g2 which is 125 v maximum. thermal characteristics quality specification in accordance with snw-fq-611-e. symbol parameter conditions min. max. unit v fs high side ?oating supply voltage operating - 570 v t 0.5 s - 630 v i vs(clamp) clamp current t 0.5 s - 35 ma v rs input voltage pin rs - 2.5 +2.5 v transient of 50 ns - 15.0 +2.5 v sr slew rate at pins s1, g1 and fs (with respect to ground) - 4 +4 v/ns p power dissipation - 500 mw t amb ambient temperature - 40 +150 c t j junction temperature - 40 +150 c t stg storage temperature - 55 +150 c q couple charge coupling at pins rref and cf operating - 8+8pc v es electrostatic handling voltage human body model; note 1 - 3000 v machine model; note 2 - 300 v symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air so14 100 k/w dip14 60 k/w r th(j-pin) thermal resistance from junction to pcb in free air so14 50 k/w dip14 30 k/w 2002 aug 02 9 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 characteristics v vs =11v; v fs - v s1 =11v; t amb =25 c; all voltages referenced to ground; see fig.7; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit high voltage supply i l leakage current on high voltage pins v fs ,v g1 and v s1 = 630 v -- 15 m a start-up state v vs(reset) reset voltage t1 off; t2 on 4.0 5.5 6.5 v v vs(start) oscillator start voltage 11.35 11.95 12.55 v v vs(stop) oscillator stop voltage 9.55 10.15 10.75 v v vs(hys) supply voltage hysteresis 1.5 1.8 2.0 v i vs(standby) standby supply current at pin vs v vs = 11 v; note 1 150 200 250 m a d v (rhv - vs) voltage difference between pins rhv and vs i rhv = 1.0 ma 0.7 0.8 1.0 v v vs(clamp-start) clamp margin v vs(clamp) to v vs(start) note 2 0.2 0.3 0.4 v i vs(clamp) clamp current v vs <17v - 14 35 ma preheat mode f start starting frequency v ci = 0 v 98 108 118 khz t g conducting time t1 and t2 f start = 108 khz - 3.2 -m s i ci(charge) charge current at pin ci v ci = 1.5 v; v rs = - 0.3v384450 m a i ci(discharge) discharge current at pin ci v ci = 1.5 v; v rs = - 0.9 v 79 93 107 m a t ph preheat time 599 666 733 ms i cp(charge) charge current at pin cp v cp =1v - 6.0 -m a i cp(discharge) discharge current at pin cp v cp =1v - 5.95 -m a d v cp(pk) peak voltage difference at pin cp when timing - 2.5 - v v rs(ctrl) control voltage at pin rs note 3 - 636 - 600 - 564 mv frequency sweep to ignition i ci(charge) charge current at pin ci v ci = 1.5 v; f ? 85 khz 0.8 1.0 1.2 m a f b bottom frequency v ci at clamp level - 42.9 - khz t ign ignition time - 625 - ms normal operation f b bottom frequency 41.21 42.90 44.59 khz t g conducting time t1 and t2 f b = 43 khz - 10.2 -m s t no non-overlap conductance time 1.05 1.4 1.75 m s i tot total supply current f b = 43 khz; note 4 0.85 1.0 1.1 ma v rs(cap) capacitive mode control voltage note 5 0 20 40 mv v rref reference voltage note 6 2.425 2.5 2.575 v v g1(on) on voltage at pin g1 ? i g1 ? = 1 ma 10.5 -- v v g1(off) off voltage at pin g1 ? i g1 ? = 1 ma -- 0.3 v v g2(on) on voltage at pin g2 ? i g2 ? = 1 ma 10.5 -- v v g2(off) off voltage at pin g2 ? i g2 ? = 1 ma -- 0.3 v r g1(on) high side driver on resistance v (g1 - s1) = 3 v; note 7 100 126 152 w 2002 aug 02 10 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 notes 1. the start-up supply current is specified in a temperature (t vj ) range of 0 to 125 c. for t vj <0 and t vj >125 c the start-up supply current is <350 m a. 2. the clamp margin is defined as the voltage difference between turn-on of the clamp and start of oscillation. the clamp is in the off-state at start of oscillation. 3. data sampling of v rs(ctrl) is performed at the end of conduction of t2. 4. the total supply current is specified in a temperature (t vj ) range of - 20 to +125 c. for t vj < - 20 and t vj >125 c the total supply current is <1.5 ma. 5. data sampling of v rs(cap) is performed at the start of conduction of t2. 6. within the allowed range of r rref , defined as 30 k w +10%. 7. typical values for the on and off resistances at t vj = 87.5 c are: r g2(on) and r g1(on) = 164 w , r g2(off) and r g1(off) = 100 w . 8. the input current at pin rhv may increase to 1600 m a during voltage transient at v in . only for currents i rhv beyond approximately 550 m a is the oscillator frequency proportional to i rhv . 9. the symmetry sym ff is calculated from the quotient sym ff =t1 tot /t2 tot , with t1 tot the time between turn-off of g2 and turn-off of g1, and t2 tot the time between turn-off of g1 and turn-off of g2. r g1(off) high side driver off resistance v (g1 - s1) = 3 v; note 7 60 75 90 w r g2(on) low side driver on resistance v g2 = 3 v; note 7 100 126 152 w r g2(off) low side driver off resistance v g2 = 3 v; note 7 60 75 90 w v drop voltage drop at bootstrap switch i fs = 5 ma 0.6 1.0 1.4 v feed-forward r i(rhv) input resistance at pin rhv 1.54 2.2 2.86 k w i i(rhv) operating range of input current at pin rhv note 8 0 - 1000 m a f ff feed-forward frequency i rhv = 0.75 ma 60.4 63.6 66.15 khz i rhv = 1 ma 80.3 84.5 88.2 khz sym ff symmetry i rhv = 1 ma; note 9 0.9 1.0 1.1 rr ripple rejection f vin = 100 hz - 6 - db r cp(sw) cp switch series resistance i cp = 100 m a 0.75 1.5 2.25 k w r av averaging resistor i cp =10 m a 22.4 32 41.6 k w symbol parameter conditions min. typ. max. unit 2002 aug 02 11 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 design equations bottom frequency: feed-forward frequency: where: C x1 = 3.68 C x2 = 22.28 C t = 0.4 m s Cr int =3k w Cc par = 4.7 pf operating frequency is the maximum of f b , f ff or f cm where: Cf b = bottom frequency Cf ff = feed-forward frequency Cf cm = frequency due to capacitive mode detection preheat time: ignition time: non-overlap time: f b 1 2c cf c par + () x1 r rref r int C () []t + {} -------------------------------------------------------------------------------------------------------------------------- - = f ff 1 2c cf c par + () x2 v rref i irhv () ------------------------------- r int C ? ?? t + ?t y ---------------------------------------------------------------------------------------------------------------------------- = t ph c cp 150 nf ------------------ r rref 30 k w ----------------- = t ign 15 16 ------ t ph = t no 1.4 m s r rref 30k w ----------------- = 2002 aug 02 12 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 application information handbook, full pagewidth mgs994 30 k w 490 k w c ci ci rhv g1 s1 fs g2 vs cp cf lamp rref sgnd pgnd rs c boot 100 nf 100 nf cs9 cs4 c4 c3 cs7 c2 ds6 ds7 ds4 ds3 ds2 ds1 13 79 14 c cp c5 100 nf 8 c cf 100 pf 12 r rref r shunt r rhv v in 10 t2 t1 11 2 3 1 6 5 uba2021 r1 l1 l2 mains supply fig.7 application diagram. 2002 aug 02 13 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 package outlines unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 sot108-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 97-05-22 99-12-27 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1 2002 aug 02 14 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 unit a max. 1 2 (1) (1) b 1 cd (1) z ee m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot27-1 95-03-11 99-12-27 a min. a max. b max. w m e e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.087 0.17 0.020 0.13 050g04 mo-001 sc-501-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 14 1 8 7 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. dip14: plastic dual in-line package; 14 leads (300 mil) sot27-1 2002 aug 02 15 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. through-hole mount packages s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 2002 aug 02 16 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 6. wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. wave soldering is suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package (1) soldering method wave reflow (2) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (3) - suitable surface mount bga, lbga, lfbga, sqfp, tfbga, vfbga not suitable suitable - hbcc, hbga, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, hvson, sms not suitable (4) suitable - plcc (5) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (5)(6) suitable - ssop, tssop, vso not recommended (7) suitable - 2002 aug 02 17 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective data development this data sheet contains data from the objective specification for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary specification. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product specification. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2002 aug 02 18 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 notes 2002 aug 02 19 philips semiconductors product speci?cation 630 v driver ic for cfl and tl lamps uba2021 notes ? koninklijke philips electronics n.v. 2002 sca74 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 613502/03/pp 20 date of release: 2002 aug 02 document order number: 9397 750 09986 |
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